Industry has been increasing the electronic components package of China steadily, has brought up ten major China and capsulated enterprises too, but the electronic component Vice President of employer’s organization of China finishes gram and permits thinking, ten major this in China capsulates enterprises and still greatlies differ from each other compared with foreign company, especially international advanced packaging technique has already led a lot of, but we still remain at DIP and QFP stage.
So should in advanced to capsulate at the ic components technical development strengthening. In addition, he still appeals for speeding up the development of army and the people’s dual-purpose device one.
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